A research project involving the Technische Hochschule Mittelhessen ) focuses on the "Development of Organic Thin-Film Transistors for Flexible Biomedical Systems." Prof. Dr. Alexander Klös from the Competence Center for Nanotechnology and Photonics is collaborating with the Max Planck Institute for Solid State Research in Stuttgart and the Institute for Microsystems Engineering at the University of Freiburg. The project is funded by the German Research Foundation (DFG). THM will receive €250,000 over the three-year project period.
The goal of the collaborating partners is to optimize organic thin-film transistors for use in biomedicine, where they are intended to replace silicon technology. The researchers are focusing on neural interfaces that enable a direct connection between the human brain and a computer. One application example is the cochlear implant, an electronic hearing prosthesis that can replace the function of the inner ear. Other potential applications include disposable ECG systems and sweat sensors.
Advantages of organic transistors that use plastics as a substrate include their flexibility and comparatively low manufacturing costs. However, the technology is currently too slow and does not yet allow for wireless transmission. Its use is further limited by its short lifespan.
The partners are dividing the work in optimizing the technology. The University of Freiburg is responsible for the circuit design, THM develops models for circuit simulation, and the Max Planck Institute is responsible for manufacturing.
Klös explains the task of his working group within the research consortium as follows: “Complex microelectronic systems require extensive simulations during the design process. So-called compact models are used here, which describe the electrical behavior of individual components and enable the analysis of even complex circuits in network simulators within a reasonable computing time. We use the results of the simulations to optimize the manufacturing process.”
The German Research Foundation (DFG) is funding the project as part of its priority program "Flexible bendable high-frequency electronics for wireless communication systems". It is one of 17 projects investigating the potential applications of various materials for the production of mechanically flexible electronics.
